TRANSFER MOLDING CAPABILITIES

As a vertically integrated manufacturer, GCG has vast resource capabilities and years of experience with Custom Molding, and specifically with Transfer Molding.  From in-house design development, to mass production, we have an experienced design staff that can work in unison with your design team to create a solution which will help set you apart from your competition.  Most of the challenges result in solutions for placement and also increase manufacturing throughput for our customers.  We use only the highest semi-conductor grade thermostat epoxy in our designs.  Our only limitation is your imagination.

Examples of our molding solutions include but are not limited to:

  • Application-specific bases
  • Epoxy over-molding for environmental protection
  • Conversion from thru-hole to surface mount
  • Over-molding capabilities for intellectual rights proprietary protection
  • Unshielded and shielded compounds available for EMI reduction

3-D Thermal Printer

  • Enables rapid prototyping
  • Reduces development cost